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Antec Nano Diamond Thermal Compound Item # 811980

Antec Nano Diamond Thermal Compound

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    Description

    Antec's Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 6 for a diamond-caliber solution.

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    Product Details

    Item # 811980 
    Manufacturer # FORMULA6  
    weight 0.14 oz
    Thermal Conductivity 5.3 W/mK
    brand name Antec
    height 3"
    Additional Information Diamond particles measuring 0.0000015 cm rated at 5.3 w/mK; Lighter, easier to spread stable composition won't crack or dry out; Extended -30°C to 250°C stable temperature range ideal for performance cooling
    quantity 1
    width 1.1"
    depth 0.7"
    Product Name Nano Diamond Thermal Compound
    manufacturer Antec, Inc
    warranty length 2-year limited
    model name Formula 6

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